Item | Description | Capability | |
Material | FR4, FR4 HIGH-TG | TG135, TG170, TG180, Halogen Free | |
CTI | CTI175, CTI300, CTI600 | ||
| High Frequency Material | Ro4350, Ro4003, 25FR, 25N | ||
| Rogers, Taconic, Arlon, Nelco, F4BK | |||
Metal substrate board | Aluminum substrate, Copper substrate | ||
HDI | High Density Interconnect | 1+N+1、1+1+N+1+1、2+N+2、3+N+3 | |
Microvia hole size | 0.1mm，0.15mm | ||
Surface Treatment | Lead | HASL | |
Lead Free | ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead free HASL etc. | ||
Plating Thickness | HASL | 2-40um | |
OSP | 0.2-0.6um | ||
ENIG | Au: 0.025-0.1um Ni: 3-8um | ||
Immersion Silver | 0.2-0.4um | ||
Immersion Tin | ≥1um | ||
Flash Gold | Au:0.025-0.1um Ni:3-8um | ||
ENEPIG | Au:0.025-0.1um Ni:3-8um Pd:0.025-0.15um | ||
Golden Finger | Au:0.25-1.5um Ni:3-8um | ||
Other Thickness | Carbon | 10-50um | |
Peelable mask | 0.2-0.4mm | ||
Drilling | Min Laser Drilling | 0.10mm | |
Max Laser Drilling | 0.15mm | ||
Mechanical Drilling | 0.15-6.5mm | ||
Aspect Ratio | 1:0.8 (Laser) 12:1 (Mechanical) | ||
Min distance Via to CU | 0.15mm(≤4Layer), 0.17mm(≤8Layer), 0.22mm(10-14Laye), 0.25mm(>14Layer) | ||
Min distance Drill to Drill | 0.15mm | ||
Hole diameter tolerance | PTH: +/-0.075 (＜6.0MM), +/-0.15 (≥6.0MM) NPTH: +/-0.05 (＜6.0MM), +/-0.10 (≥6.0MM) | ||
Press fit Holes Tolerance | +/-0.05mm | ||
Counterbore/Countersink Diameter TOL | +/-0.15mm | ||
Counterbore/Countersink Depth TOL | +/-0.15mm | ||
Blind slots (Z-milling) | Yes, +/-0.15mm | ||
Backdrilling | Yes, +/-0.10mm | ||
Min Land Size | Min Pad for via | 0.25mm(Laser Drill) 0.4mm(Mechanical drilling) | |
Min BGA Size | 0.18mm(Flash Gold) 0.3mm(Lead Free HASL) 0.25mm(Other) | ||
BGA Size Tolerance | +/-15% or +/-1.5mil(BGA≤10mil) | ||
Outer layer | Samples | Mass Productions | |
Base Copper 1/3OZ | 3/3mil | 3.5/4mil | |
Base Copper 1/2OZ | 3.9/4mil | 4/5mil | |
Base Copper 1OZ | 5/6mil | 5.5/7mil | |
Base Copper 2OZ | 6/8mil | 6/9mil | |
Base Copper 3OZ | 6/11mil | 7/12mil | |
Base Copper 4OZ | 7.5/15mil | 8/16mil | |
Base Copper 5OZ | 9/18mil | N/A | |
Base Copper 6OZ | 10/21mil | N/A | |
Trace Width Tolerance | +/-20% | ||
Inner layer | 1/2OZ | 3/3mil | 3/4mil |
1OZ | 3.5/4mil | 4/5mil | |
2OZ | 5/6mil | 5/8mil | |
3OZ | 6/8.5mil | 6/10mil | |
4OZ | 6/12mil | 7/12mil | |
5OZ | 8/15mil | N/A | |
6OZ | 10/17mil | N/A | |
Trace Width Tolerance | +/-20% | ||
Solder Mask | Colors | Green, Yellow ,Black, White, Blue, Red, Matte green | |
Min dam width | 0.1mm(green color) , 0.15mm(other colors) | ||
Thickness | 10-18um(Corner≥5um) | ||
Legend | Colors | White, Black, Yellow | |
Min. Legend Height | 0.6mm | ||
Profile | CNC Routing Tolerance Min. | +/-0.1mm | |
Copper to outline center | 0.2mm | ||
V-scoring Angles | 20 30 45 60 Deg | ||
V-score Depth | 1/3 of board thickness | ||
Copper to V-cut Center | 0.4mm | ||
Beveling Angles | 30, 45 Deg (+/-5 Deg) | ||
Beveling Depth | +/-0.1mm | ||
Metal substrate board | Layer count | Metal substrate: 1-12L, Ceramic substrate: 1-2L | |
Finished Size | 610*610mm(Max) 5*5mm(Min) | ||
Board Thickness | 0.5-5.0mm | ||
Max copper thickness | 8OZ(Outer) | ||
Thermal conductivity | Standard materials: 1-3W/m.k, Specified materials : 4-12W/m.k Ceramic materials: 24-170W/m.k | ||
Other | Max copper thickness | 8OZ(Outer) 7OZ(Inter) | |
Layer Count | 1-24 | ||
Board thickness | 0.4mm~5.0mm | ||
Board thickness TOL | ±10%(>1.0mm); ±0.1mm(≤1.0mm) | ||
Min board dimensions | 10*10mm | ||
Max board dimensions | 20*30inch(2Layer), 22.5*30inch(4Layer), 16.5*22.5inch(≥6Layer) | ||
Twisting and bending | ≤0.75% Min0.5% | ||
Impedance Tolerance | ±5Ω(<50Ω), ±10%(≥50Ω) | ||
VERIFIED BY
SOCIAL MEDIA
