Stencil thickness should meet the minimum spacing QFP, BGA , taking into account the smallest chip components.
QFP pitch≤0.5MM , stencil thickness 0.12mm; QFP pitch>0.5MM, stencil thickness 0.15mm-0.18mm ; BGA pitch>1.0mm , stencil thickness 0.15mm , 0.5mm≤BGA pitch≤1.0mm, tencil shim thickness 0.12mm . (Refer to .....)