ITEM | DESCRIPTION | CAPABIBITY |
Material | Type | Adhesive,Adhesive halogen-free |
Polyimide Thickness | 0.5mil,1mil,2mil | |
Adhesive Thickness | 0.5mil,0.8mil | |
Copper Thickness | 1/3oz,1/2oz,1oz |
Coverlayer | Polyimide Thickness | 15um, 25um, 50um |
Adhesive Thickness | 12.5um, 20um,25um | |
Colors | White, Black, Yellow | |
Min Coverlayer Opening Size | 0.40mm(Drill), 0.25mm(Laser), 0.7mm(punch) | |
Min Space Between Coverlayer Opening | 0.15mm(Drill), 0.20mm(Laser), 0.6mm(punch) | |
Edge of Coverlayer Opening to Trace | 0.15mm |
Stiffeners | PI | 0.1mm-0.25mm |
PET | 0.1mm-0.18mm | |
Fr4 | 0.1mm-1.2mm | |
Metal | 0.1mm-0.3mm |
Surface Treatment | ENIG | Au: 0.025-0.1um Ni: 3-8um |
Flash Gold | Au: 0.025-0.1um Ni:3-8um | |
Immersion Tin | ≥1um | |
OSP | 0.2um-0.6um |
Drilling | Min Laser Drilling | 0.1mm |
Mechanical Drilling | 0.2mm-6.5mm | |
Aspect Ratio | 1:0.8(Laser) 12:1(Mechanical) | |
Min distance Via to Conductor | 0.2mm(≤4Layer), 0.25mm(≤6Layer) | |
Min distance Drill to Drill | 0.2mm | |
Copper Plated Thickness | Double side board: ≥8um, Multilayer: ≥12um, Rigid flex board: ≥18um, TFT :8-15um |
Annular Ring | Outer layer | 0.15mm |
Inter layer | 0.15mm(4Layer) | |
0.25mm(6Layer) | ||
0.30mm(6Layer) |
Minimum Line/Spacing, External | Base Copper 1/3OZ | 0.07/0.07mm |
Base Copper 1/2OZ | 0.08/0.10mm | |
Base Copper 1OZ | 0.10/0.12mm | |
Trace Width Tolerance | +/-20% |
Minimum Line/Spacing, Internal | Copper 1/3OZ | 0.07/0.07mm |
Copper 1/2OZ | 0.08/0.10mm | |
Copper 1OZ | 0.10/0.12mm | |
Trace Width Tolerance | +/-20% |
Solder Mask | Colors | Green,Yellow,White,Black,Blue,Red,Matte Green |
Min dam width | 0.1mm(Green) | |
0.15MM(Other) | ||
Thickness | 10-18um(Corner>=5um) |
Legend | Colors | White,Black,Yellow |
Min. Legend Height | 0.8mm |
Profile | Mechanical Routed Part Size Tol. | +/-0.10mm |
Laser Router Part Size Tol. | +/-0.10mm | |
Min. Diameter Router Cutter | 0.8mm | |
Copper to Outline Center | 0.2mm |
EMI Shield Film | SF-PC5000/5500/5900 | 11um/22um/9um |
SF-PC1000 | 32.1um | |
TSS200/TSS100 | 22um/12um |
Other | Max Copper Thickness | 2oz |
Layer Count | 1-6(Flexible); 2-8(Rigid-Flex) | |
Board Thickness(Flexible) | 1L:0.10mm-0.16mm; 2L:0.13mm-0.25mm | |
4L:0.25mm-0.45mm; 6L:0.35mm-0.45mm | ||
Fpc Thickness Tolerance | +/-0.05mm( | |
Min. Board Dimensions | 5*8mm | |
Max Board Dimensions | 230*330mm(Convention); 480*630(Special) | |
Impedance Tolerance | +/-5Ω (<=50Ω); +/-10%(>50Ω) |
| King Credie Techonlogy Ltd. |
VERIFIED BY
SOCIAL MEDIA
