ITEM | DESCRIPTION | CAPABIBITY |
Material | FR4, FR4 HIGH-TG | TG135, TG170, TG180, Halogen Free |
CTI | CTI175, CTI300, CTI600 | |
High Frequency Material | Rogers, Taconic, Arlon, Nelco, F4BK (Ro4350, Ro4003, 25FR, 25N...) | |
Metal Substrate Board | Aluminum Substrate, Copper Substrate |
HDI | High Density Interconnect | 1+N+1, 1+1+N+1+1, 2+N+2, 3+N+3 |
Microvia Hole Size | 0.1mm, 0.13mm, 0.15mm |
Surface Treatment | Lead | HASL |
Lead Free | ENIG, ENEPIG, Immersion Sliver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead Free HASL ect. |
Plating Thickness | HASL | 2-40um |
OSP | 0.2-0.6um | |
ENIG | Au: 0.025-0.1um Ni: 3-8um | |
Immersion Silver | 0.2-0.4um | |
Immersion Tin | ≥1um | |
Flash Gold | Au:0.025-0.1um Ni:3-8um | |
ENEPIG | Au:0.025-0.1um Ni:3-8um PB:0.025-0.15um | |
Golden Finger | Au:0.025-1.5um Ni:3-8um |
Other Thickness | Carbon | 10-50um |
Peelable | 0.2-0.4mm |
Drilling | Min Laser Drilling | 0.10mm |
Max Laser Drilling | 0.15mm | |
Mechanical Drilling | 0.15mm-6.50mm | |
Aspect Ratio | 1:0.8(Laser), 12:1(Mechanical) | |
Min distance via to Cu | 0.15(≤4Layers), 0.17mm(≤8Layers) | |
0.22mm(10-14Layers), 0.25mm(>14Layers) | ||
Min distance Drill to Drill | 0.15mm | |
Hole diameter tolerance | PTH: +/-0.075 (＜6.0MM), +/-0.15 (≥6.0MM) | |
NPTH: +/-0.05 (＜6.0MM), +/-0.10 (≥6.0MM) | ||
Press fit holes tolerance | +/-0.05mm | |
Counterbore/Countersink Diameter TOL | +/-0.15mm | |
Counterbore/Countersink depth TOL | +/-0.15mm | |
Blind slots (Z-milling) | +/-0.15mm | |
Backdrilling | +/-0.10mm |
Min Land Size | Min Pad for via | 0.25mm(Laser Drill)，0.4mm(Mechanical Drilling) |
Min BGA Size | 0.18mm(Flash Gold), 0.3mm(Lead Free HASL), 0.25mm(Other) | |
BGA Size Tolerance | +/-15% or +/-1.5mil(BGA≤10mil) |
Outer Layer | Base Copper | Samples | Mass Productions |
| 1/3OZ | 3/3mil (Track/Gap) | 3.5/4mil (Track/Gap) | |
| 1/2OZ | 3.9/4mil | 4/5mil | |
| 1OZ | 5/6mil | 5.5/7mil | |
| 2OZ | 6/8mil | 6/9mil | |
| 3OZ | 6/11mil | 7/12mil | |
| 4OZ | 7.5/15mil | 8/16mil | |
| 5OZ | 9/18mil | N/A | |
| 6OZ | 10/21mil | N/A | |
| Trace Width Tolerance: | +/-20% | +/-20% |
Inter Layer | Base Copper | Samples | Mass Productions |
| 1/2OZ | 3/3mil (Track/Gap) | 3/4mil (Track/Gap) | |
| 1OZ | 3.5/4mil | 4/5mil | |
| 2OZ | 5/6mil | 5/8mil | |
| 3OZ | 6/8.5mil | 6/10mil | |
| 4OZ | 6/12mil | 7/12mil | |
| 5OZ | 8/15mil | N/A | |
| 6OZ | 10/17mil | N/A | |
| Trace Width Tolerance: | +/-20% | +/-20% |
Legend | Colors | White, Black, Yellow |
Min. Legend Height | 0.6mm |
Solder Mask | Colors | Green, Yellow ,Black, White, Blue, Red, Matte green |
Min Dam Width | 0.1mm(green color) , 0.15mm(other colors) | |
Thickness | 10-18um(Corner≥5um) |
Profile | CNC Routing Tolerance Min. | +/-0.10mm |
Copper to Outline Center | 0.2mm | |
V-scoring Angles | 20, 30, 45, 60 Deg | |
V-scoring Depth | 1/3 of Board Thickness | |
Copper to V-scoring Center | 0.4mm | |
Beveling Angles | 30, 45 Deg (+/-5 Deg) | |
Beveling Depth | +/-0.10mm |
Metal Substrate Board | Board Type | Aluminum substrate, Copper substrate, Embed Copper Core PCB, Direct Thermal Path PCB |
Layer Count | Metal substrate: 1-12L, Ceramic substrate: 1-2L | |
Finished Size | 610*610mm(Max) 5*5mm(Min) | |
Board Thickness | 0.5-5.0mm | |
Max Copper Thickness | 0.5-10 OZ | |
Thermal Conductivity | Standard materials: 1-3W/m.k, | |
Specified materials : 4-12W/m.k | ||
Ceramic materials: 24-170W/m.k |
Other | Max Copper Thickness | 8OZ(Outer) 7OZ(Inter) |
Layer Count | 1-24L | |
Board Thickness | 0.4mm~5.0mm | |
Board Thickness TOL | ±10%(>1.0mm); ±0.1mm(≤1.0mm) | |
Min Board Dimensions | 10*10mm | |
Impedance Tolerance | ±5Ω(<50Ω), ±10%(≥50Ω) | |
Max Board Dimensions | 20*30inch(2Layer) | |
22.5*30inch(4Layer) | ||
16.5*22.5inch(≥6Layer) | ||
Twisting and Bending | ≤0.75% Min0.5% |
| King Credie Techonlogy Ltd. |
VERIFIED BY
SOCIAL MEDIA
