| Item | Description | Capability |
| Material | Type | Adhesive, Adhesive, Halogen- free |
| Polyimide Thickness | 0.5mil,1mil,2mil | |
| Adhesive Thickness | 0.5mil, 0.8mil | |
| Copper (ED ,RA) | 1/3oz 1/2oz 1oz | |
| Coverlayer | Polyimide Thickness | 15um, 25um, 50um |
| Adhesive Thickness | 12.5um, 20um,25um | |
| Colors | White, Black, Yellow | |
| Min Coverlay Opening Size | 0.40mm(Drill), 0.25mm(Laser), 0.7mm(punch) | |
| Min Space Between Coverlay Opening | 0.15mm(Drill), 0.20mm(Laser), 0.6mm(punch) | |
| Edge of Coverlay Opening to Trace | 0.15mm | |
| Stiffeners | PI | 0.1-0.25mm |
| PET | 0.1-0.18mm | |
| Fr4 | 0.1-1.2mm | |
| Metal | 0.1-0.3mm | |
| Surface Treatment | ENIG | Au: 0.025-0.1um Ni: 3-8um |
| Flash Gold | Au:0.025-0.1um Ni:3-8um | |
| Immersion Tin | ≥1um | |
| OSP | 0.2-0.6um | |
| Drilling | Min Laser Drilling | 0.1mm |
| Mechanical Drilling | 0.2-6.5mm | |
| Aspect Ratio | 1:0.8(Laser) 12:1(Mechanical) | |
| Min distance Via to Conductor | 0.2mm(≤4Layer), 0.25mm(≤6Layer) | |
| Min distance Drill to Drill | 0.2mm | |
| Copper Plated Thickness | Double side board: ≥8um | |
| Multilayer: ≥12um | ||
| Rigid flex board: ≥18um | ||
| TFT :8-15um | ||
| Annular ring | Outer layer | 0.15mm |
| Inter layer | 0.15mm(4Layer) | |
| 0.25mm(6Layer) | ||
| 0.30mm(6Layer) | ||
| Out layer | Base Copper 1/3OZ | 0.07/0.07mm |
| Base Copper 1/2OZ | 0.08/0.10mm | |
| Base Copper 1OZ | 0.10/0.12mm | |
| Trace Width Tolerance | +/-20% | |
| Inter layer | Copper 1/3OZ | 0.07/0.07mm |
| Copper 1/2OZ | 0.08/0.10mm | |
| Copper 1OZ | 0.10/0.12mm | |
| Trace Width Tolerance | +/-20% | |
| Solder Mask | Colors | Green, Yellow , Black, White, Blue, Red, Matte green |
| Min dam width | 0.1mm（green color） 0.15mm(other colors ) | |
| Thickness | 10-18um(Corner≥5um) | |
| Legend | Colors | Yellow, White, Black |
| Min. Legend Height | 0.8mm | |
| Profile | Mechanical Routed Part Size Tolerance | +/-0.10mm |
| Laser Routed Part Size Tolerance | +/-0.10mm | |
| Min. Diameter Rout Cutter | 0.8mm | |
| Copper to Outline Center | 0.2mm | |
| EMI Shield Film | SF-PC5000/5500/5900 | 11um/22um/9um |
| SF-PC1000 | 32.1um | |
| TSS200/TSS100 | 22um/12um | |
| Other | Max Copper Thickness | 2OZ(Outer) 2OZ(Inter) |
| Layer Count | 1-6(Flexible) 2-6(Rigid Flex) | |
| Board Thickness | 1L: 0.10mm-0.16mm 2L: 0.13- 0.25mm | |
| 4L: 0.25mm-0.45mm 6L: 0.35- 0.45mm | ||
| FPC Thickness Tolerance | +/-0.05mm(≤0.5mm) ; +/-10%mm(>0.5mm) | |
| Min board dimensions | 5*8mm | |
| Max board dimensions | 230*330mm(Convention); 480*630mm(Special) | |
| Twisting and bending | ≤0.75% Min0.5% | |
| Impedance Tolerance | +/-5Ω(<50Ω) , +/-10%(≥50Ω) |
VERIFIED BY
SOCIAL MEDIA
