Type:High Frequency Pcb
PRODUCT DESCRIPTION
Board Thickness | 1.524 mm |
Base Material | Rogers4350B |
Copper Thickness | 1OZ |
Min. Line Width/ Spacing | 6mil (0.15mm)/6mil (0.15mm) |
Soldermask | None |
Silkscreen Color | None |
Surface Finishing | ENIG |
Min.Quantity of Order | No MOQ |
Layer Count | 2 Layer |
Difficulty | Rogers 4350B |
RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
Dk of 3.48 +/- 0.05
Dissipation factor of 0.0037 at 10 GHz
Low Z-axis coefficient of thermal expansion at 32 ppm/°C
Processes like FR-4 at lower fabrication cost
Competitively priced
Excellent dimensional stability
● IPC-4101 Specification for base materials rigid / multi-layer
● IPC-600G Acceptability of Printed Boards / Class 2
● IPC-6011 Generic Performance Specification for Printed Wiring Boards
● IPC-6012B -Qualification and Performance Specification for Rigid Boards/class 2
● IPC6013A- Qualification and Performance Specification for Flexible Printed Boards/class 2
● IPC6016- Qualification and Performance Specification for High Density Interconnect(HDI) Layers or Boards/ class 2
● IPC-SM-840 Qualification and Performance of permanent polymer coatings
● MIL-PFR-55110 Military Performance and Specifications-Tucson
● IPC-6018 Microwave End Product Board Inspection and Test-Tucson
● IPC-TM-650 Test methods manual.
PRODUCT CONSULTATION