Rogers Pcb Stackup Design

RO4000® Laminates

Industry leading RO4000® hydrocarbon ceramic laminates and prepregs offer superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.

RO4000 material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. RO4000 series laminates offer a range of dielectric constants (2.55 - 6.15), are available with UL 94 V-0 flame retardant versions.

Benefits

·         Optimized cost and RF / microwave performance

·         Compatible with FR-4 fabrication including multilayer PCB constructions

·         High thermal conductivity for improved thermal management over traditional PTFE materials

·         Robust lead-free solder processing compatibility

·         Low Z-axis CTE for reliable plated through-hole quality

Typical Applications

·         Cellular Base Station Antennas and Power Amplifiers

·         Microwave point to point (P2P) links,Automotive Radar and Sensors

·         RF Identification (RFID) Tags,LNB’s for Direct Broadcast Satellites

RO4000® LoPro® Laminates

·         Proprietary technology that allows reverse treated foil to bond to standard RO4000 delectric

·         Significantly improves insertion loss and passive intermodulation (PIM) performance

RO4003C™ Laminates

·         Lowest dielectric loss of the RO4000® product family

·         The original RO4000 material used for over a decade in cost sensitive Microwave/RF designs

·         Dk 3.38 (+/- 0.05); Df 0.0027@10GHz

RO4350B™ Laminates

·         The market leading material for base station power amplifier designs

·         Low loss, FR-4 processable and UL 94V-0 rated material

·         Dk 3.48 (+/- 0.05); Df 0.0037@10GHz

RO4450B™ Prepregs (Bondply)

·         Based on RO4000 platform for low Dissipation Factor (.004 @ 10 GHz) and consistent Dielectric Constant (Dk)

·         Fully compatible with FR-4 materials for complex hybrid multilayer designs

·         UL 94-V0 rated

Rogers PCB 2L stack up

Example 1

Example 2

Rogers PCB Multilayer PCB stack up

Type A: Two  Rogers Core

Example 1

Type B: Mixed Dielectric  (Hybrid stack-up)

Mixed high frequency construction can reduce costs when the need for RF dielectric is local and only between some layers. The rest of the dielectric can be FR4 or halogen-free FR4.

Example 1

Example 2